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Computer-On-Modules

Computer-On-Module (COM/SOM modules) are ideal for applications where product time to market and longevity are critical to your business. Today’s COM modules mainly come in two main formats; COM Express (COMe) in Mini, Compact, Basic and Qseven.

Plugged into carrier boards, they can be upgraded to newer, backwards-compatible versions as processor technology capability progresses. COM/SOM modules are typically used in Industrial, military, aerospace, gaming, medical and transportation.

• Why use a Computer-on-module? What are the Benefits?
• COM Express vs Qseven vs SMARC: A Comparison of Modular Embedded Computing Standards
• An Introduction to COM-HPC

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  • COM 1001 1

    ASRock Industrial COM-1001 Elkhart Lake COM Express Mini

    • Product Name: ASRock Industrial COM-1001
    • Motherboard Form Factor: COM Express Module
    • CPU: Intel® Elkhart Lake SoC Processors
    • RAM: 4 x 4GB IBECC onboard LPDDR4/4x 3200 MHz
    • Expansion: 4 x PCIe x1 (Gen3), 2 x USB 3.2 Gen2, 8 x USB 2.0, 2 x UART, 2 x SATA3
    • Other features: 1 x Intel 2.5 Gigabit LAN, Supports Dual Display, 2 x DDI, 1 x eDP, 1 x DP or HDMI, TPM 2.0 onboard IC (optional), ATX: 12V±5%/5Vsb±5%, AT: 9~20V±5%
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  • EHL700

    DFI EHL700 Intel Elkhart Lake Celeron / Atom Qseven

    • Product Name: DFI EHL700
    • Motherboard Form Factor: Intel Elkhart Lake Celeron / Atom Qseven
    • CPU: Intel Elkhart Lake Celeron / Atom
    • RAM: 4GB/8GB LPDDR4 Single Channel Memory Down
    • Expansion: Multiple expansions: 4 PCIe x1
    • Other features: 1 DDI*, 1 LVDS*/eDP, DP++ resolution supports up to 4096×2160 @ 60Hz, Rich I/O: 1 Intel GbE, 3 USB 3.1, 8 USB 2.0, 15-Year CPU Life Cycle Support Until Q1′ 36 (Based on Intel IOTG Roadmap)
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  • EHL9A2 Top w600

    DFI EHL9A2 Intel Elkhart Lake COM Express Mini

    • Product Name: DFI EHL9A2
    • Motherboard Form Factor: COM Express Mini – COM Express Type 10
    • CPU: Intel® Atom® Processor Elkhart Lake Series
    • RAM: Dual Channel LPDDR4X 3200MHz/4267MHz up to 16GB
    • Expansion: Multiple expansions: 4 PCIe x1
    • Other features: 1 LVDS/eDP, 1 DDI (HDMI/DP++); Supports dual displays: DDI + LVDS/eDP, Rich I/O: 1 Intel GbE, 4 USB 3.1, 8 USB 2.0, 15-Year CPU Life Cycle Support Until Q1′ 36 (Based on Intel IOTG Roadmap).
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